Epoxy molding compounds
Epoxy molding compounds (EMC) represent a category of advanced materials utilized in electronic packaging, primarily consisting of epoxy resin, phenolic compounds, curing agent, fillers, and various additives.
To safeguard electronic components against mechanical damage, contamination, and moisture, mass production techniques such as injection molding or transfer molding are typically employed to encapsulate these components within the EMC. Upon curing, the epoxy resin develops a three-dimensional network structure that exhibits superior mechanical properties as well as resistance to heat and moisture, rendering it highly effective in protecting devices from environmental factors.
Source: Wikipedia
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